Heat sink for memory module



FIG. 1 is a perspective view of a heat sink for memory module of the claimed design;

FIG. 2 is another perspective view of FIG. 1;

FIG. 3 is a front elevational view of FIG. 1;

FIG. 4 is a rear elevational view of FIG. 1;

FIG. 5 is a left side elevational view of FIG. 1;

FIG. 6 is a right side elevational view of FIG. 1;

FIG. 7 is a top plan view of FIG. 1;

FIG. 8 is a bottom plan view of FIG. 1; and,

FIG. 9 is an enlarged view illustrating the details of the dot-dash area “9” shown in FIG. 1.

The broken lines in the drawings depict portions of the heat sink for memory modul that form no part of the claimed design.

The dot-dash lines in the figures represent the boundaries of the enlarged areas in which the dot-dash lines form no part of the claimed design. 

CLAIM The ornamental design for a heat sink for memory module, as shown and described. 